A. 4%
B. 6%
C. 8%
D. 10%
Related Mcqs:
- Which of the following is correct glass transition temperature of Impression compound ?
A. 43.5°C
B. 39°C
C. 65°C
D. 100°C - The best way to remove a hydrocolloid impression from the patient’s mouth is____________?
A. Slight rocking of the impression to disengage it from the undercut
B. Wetting the periphery of the impression with moist cotton to break the peripheral seal
C. Sudden jerking of the impression to prevent tearing
D. Supporting the impression along with the tray to prevent disengaging of the tray alone - The impression for a diagnostic cast of a partial edentulous mouth should be taken in_______________?
A. Impression wax
B. Modelling compound
C. Hydro-colloid
D. Hydro cal - Alginate impression material is similar to Agar-agar impression material in the following respect________________?
A. Gelation increase in both on increase in temperature
B. Mixing time is increased to reduce the setting time
C. Deformation during removal of impression occurs due to distortion of gel fibers
D. Both can be re-used for fresh impressions - Which of the following impression materials is easy to pour and difficult to remove the stone cast from the impression ?
A. Addition polysilicone
B. Condensation polysilicone
C. Polyether
D. Polysulfide - Best impression material to be used for securing impression after crown preparation_______________?
A. Alginate
B. Agar
C. Elastome
D. Zno paste - Agar impression materials differ from alginate impression materials in that the former sets by_______________?
A. Mechanical action of saliva
B. Physical change
C. Evolution
D. Chemical change - Type I and Type II zinc oxide impression paste differ with respect to_______________?
A. Their use
B. Their hardness after setting
C. Water content
D. Eugenol content - Impression compound has which of the following characteristic property ?
A. Low thermal conductivity
B. High flow property
C. Degradation is presence of moisture
D. Remain distortion free up to 72 hrs. pouring can be safely delayed - Impression compound base_____________?
A. Low thermal conductivity
B. Crystalline structure
C. Formation of cross linkage with heating
D. High fusion temperature