Electrolyte used for plating copper dies is________________?

Related Mcqs:

1. A common electrolyte used for plating copper indirect dies is_______________?

   A. Copper cynide
   B. Ionic copper
   C. Acidic copper sulfate
   D. Silver cyanide

2. Copper content in low copper amalgam is________________?

   A. 6%
   B. 12-30%
   C. 29%
   D. 19%

3. The percentage of copper in high copper alloy is______________?

   A. 10-12%
   B. 0-6%
   C. 13-30%
   D. 20-30%

4. High copper dental amalgams are superior to other amalgams because high copper dental amalgems______________?

   A. Have less marginal breakdown
   B. Are workable at lower Hg-alloy ratio
   C. Have a higher ratio of tensile to compressive strength
   D. Have less resistance to tarnish and corrosion

5. In ECF main electrolyte is_______________?

   A. Na+
   B. K+
   C. Cl
   D. Proteins

6. In a high copper amalgam the phase, which is eliminated is_______________?

   A. Gamma 1
   B. Gamma 2
   C. Gamma 1 and 2
   D. No phase is eliminated

7. High copper amalgam can be produced_____________?

   A. From smooth atomized particles
   B. From irregular and spherical particles
   C. From lathe cut particles
   D. From traditional alloy particles

8. Which of the following are characteristic feature of high copper amalgam alloy ?

   A. Low compressive strength
   B. High marginal breakdown
   C. Less marginal #
   D. High creep

9. Which is not true about high copper amalgam alloys______________?

   A. Low tensile and compressive strength
   B. Low Hg: Alloy ratio
   C. High tensile strength
   D. Low creep

10. Percentage of tin in low copper alloy is______________?

    A. 30-35%
    B. 26-28%
    C. 13-32%
    D. 22-30%