A common electrolyte used for plating copper indirect dies is_______________?

Related Mcqs:

1. Electrolyte used for plating copper dies is________________?

   A. Ionic copper
   B. Copper cyanide
   C. Silver cyanide
   D. Acidic copper sulphate

2. The percentage of copper in high copper alloy is______________?

   A. 10-12%
   B. 0-6%
   C. 13-30%
   D. 20-30%

3. Copper content in low copper amalgam is________________?

   A. 6%
   B. 12-30%
   C. 29%
   D. 19%

4. High copper dental amalgams are superior to other amalgams because high copper dental amalgems______________?

   A. Have less marginal breakdown
   B. Are workable at lower Hg-alloy ratio
   C. Have a higher ratio of tensile to compressive strength
   D. Have less resistance to tarnish and corrosion

5. In ECF main electrolyte is_______________?

   A. Na+
   B. K+
   C. Cl
   D. Proteins

6. In a high copper amalgam the phase, which is eliminated is_______________?

   A. Gamma 1
   B. Gamma 2
   C. Gamma 1 and 2
   D. No phase is eliminated

7. With indirect spruing. Which one of the following porosities can be minimised_______________?

   A. Back pressure porosity
   B. Localized shrinkage porosity
   C. Pin hole porosity
   D. Micro porosity

8. The most common sequence of eruption of the permanent maxillary teeth in children is_______________?

   A. 1-6-2-3-4-7-5-8
   B. 2-3-1-6-7-5-4-8
   C. 6-1-2-4-3-5-7-8
   D. 6-1-2-3-4-5-7-8

9. A common side effect associated with all NSAID drugs is_______________?

   A. Drowsiness
   B. Gastric irritation
   C. Xerostomia
   D. Constipation

10. Most common primary malignant bone tumor is_______________?

    A. Osteosarcoma
    B. Ewing sarcoma
    C. Metastatic carcinoma
    D. Multiple Myeloma